Recently, REWA Academy pupils provided feedback that the two layers often fail to fit closely in double-stacked motherboard repair work There are also large voids, causing pseudo soldering In response, we will certainly share suggestions and also notes when separating as well as recombining double-stacked motherboard Remove foam on the motherboard before home heating Please be noted that we do not recommend newbies to warm the motherboard with a hot air weapon Due to the fact that the motherboard may receive heat erratically and deform A specialist motherboard heating system is what we recommend To assist in later on elimination of the reasoning board, drive a screw on the logic board Cut with the tape with a Sculpture Knife The logic board as well as center layer are soldered with low-temperature solder paste So the very best temperature for the heating platform will certainly be 155 ° C-165 ° C Press the logic board delicately with tweezers when the temperature reaches 165 ° C If the logic board is loosened, the tin has actually melted Clamp the screw to eliminate the logic board Eliminate the signal board Get rid of thermal grease with a Sculpture Knife Thermal oil must be eliminated totally Or else, the thermal oil will touch the logic board to trigger pseudo soldering in recombination Affix the signal board to the owner Apply a round of Paste Change Get rid of tin on the bonding pad with Blowpipe at 365 ° C as well as Solder Wick Tin on the bonding pad should be completely gotten rid of The recurring tin will impact the subsequent soldering Clean the bonding pad with PCB Cleaner Clean the logic board with the same approach Please do not damage parts around the bonding pad of the logic board while cleansing It is necessary to inspect if the bonding pad is cool after cleaning up Connect the signal board to the Reballing Platform Put the reballing stencil ready to ensure that it is pushing against the signal board To avoid the solder paste from flowing into the motherboard space, place a metal plate Apply a layer of low-temperature Solder Paste Wipe off excess solder paste with a Lint-free Wipe Remove the reballing pattern Inspect if solder paste on the signal board is full While using solder paste, please see to it that solder paste have to have a certain humidity If the solder paste is also completely dry, it will certainly follow the reballing pattern when the stencil is removed Therefore, the solder paste on the signal board will not be uniform, which can quickly bring about inadequate soldering Placed the signal board on the 165 ° C Home heating System to warm Quit home heating after the solder rounds are developed Apply a percentage of Paste Change after the signal board has cooled Align the logic board with the signal board Keep home heating on the 165 ° C Home Heating Platform When the solder change spills and also reasoning board sinks, push the logic board delicately with tweezers to guarantee the 2 layers fit carefully The push must be gentle and also small Tidy the motherboard with PCB Cleanser after the motherboard has cooled If you locate the motherboard deformed while recombining, you can put the motherboard on a flat board and fasten it with an elastic band Press 2 sides of the motherboard carefully To prevent crushing elements, please place a soft paper under the motherboard Following, we will share an additional recombination technique The technique can be taken if the middle bonding pad is not damaged When the tin melts, remove the logic board in an upright manner with tweezers It can be seen that there is a steel pad of 0.05 mm thickness around the signal board at a specific distance This steel pad is designed to maintain a 0.05 mm void in between the reasoning board as well as the center layer, preventing the solder rounds from connecting while soldering You just require to eliminate thermal grease on the motherboard when the fixing is done Maintain original tin on the bonding pad Use a little quantity of Paste Flux Finally, line up the logic board with the signal board When the temperature level reaches 165 ° C and also the tin thaws, turn the power off Press 2 ends of the reasoning board with tweezers till the motherboard has cooled The reasoning board and also the signal board fit very closely in this way There will certainly be no connecting and also solder spheres spillover Browse through REWA Academy if you intend to discover more repair service abilities We have total program bundles for motherboard diagnosis and fixing ability improvement Click the link in the comment area to buy motherboard fixing course packages Thanks for enjoying and really feel free to leave a remark
